Cmp retaining ring

ABSTRACT

An improved chemical mechanical polishing retaining ring. A representative embodiment comprises a base portion made from a wear-resistant plastic material, and an upper portion, or backbone portion, made from a stiffer and more wear resistant material. One of the base or backbone portion is preferably overmolded onto the other. The base portion can be generally defined by a flat pad-contacting surface, an outer surface, and an inner surface. The base portion can additionally include channels extending from the outer surface to the inner surface to facilitate transfer of slurry to and from the substrate to be polished during the process. One or both of the base portion or backbone portion further includes a plurality of circular ribs that serve to create additional bonding surface with the overmolded material. The retaining ring may additionally includes a plurality of bosses with threaded insert holes by which the retaining ring is attached to a chemical mechanical polishing system.

PRIORITY APPLICATION

This application is a continuation of U.S. patent application Ser. No.12/568,497, filed Sep. 28, 2009, (U.S. Pat. No. 7,857,683, issuing Dec.28, 2010) which is a continuation of U.S. patent application Ser. No.11/440,461, filed May 24, 2006, the disclosures of which are herebyincorporated by reference in its entirety, which claims priority to U.S.Provisional Patent Application No. 60/684,151, filed May 24, 2005, ofthe same title, the disclosure of which is hereby incorporated byreference in its entirety, and U.S. Provisional Patent Application No.60/765,995, filed Feb. 6, 2006, of the same title, the disclosure ofwhich is hereby incorporated by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates to a retaining ring for holdingsemiconductor wafers in a chemical mechanical polishing apparatus.

BACKGROUND OF THE INVENTION

Integrated circuits can be formed on semiconductor substrates,particularly silicon wafers, by the sequential deposition of conductive,semiconductive and insulative layers on the wafer. Circuitry featurescan be etched on after each layer is deposited. After a series of layershave been deposited and etched, the uppermost surface of the substratecan become increasingly non-planar. Non-planar surfaces can causeproblems in the photolithographic steps of the integrated circuitfabrication process. As such, it is necessary to periodically planarizethe semiconductor substrate surface.

Damascene is a process in which interconnecting metal lines are formedby isolating dielectrics. In damascening, an interconnecting pattern isfirst lithographically defined in the layer of dielectric, and thenmetal is deposited to fill in the resulting trenches. Excess metal canbe removed by chemical-mechanical polishing (planarization).Chemical-mechanical polishing (CMP), also called chemical-mechanicalplanarization, refers to a method of removing layers of solid throughchemical-mechanical polishing carried out for the purpose of surfaceplanarization and definition of the metal interconnecting pattern. Dualdamascene is a modified version of the damascene process that is used toform metal interconnecting geometry using a CMP process instead of metaletching. In dual damascene, two interlayer dielectric patterning stepsand one CMP step create a pattern that would otherwise require twopatterning steps and two metal CMP steps when using a conventionaldamascene process.

In a typical CMP operation, a rotating polishing pad, which receives achemically reactive slurry, is used to polish the outermost surface ofthe substrate. The substrate is positioned over the polishing pad and isheld in place by a retaining ring. Typically the substrate and retainingring are mounted on a carrier or polishing head. A controlled force isexerted on the substrate by the carrier head to press the substrateagainst the polishing pad. The movement of the polishing pad across thesurface of the substrate causes material to be chemically andmechanically removed from the face of the substrate.

The machinery used to perform CMP is highly sophisticated, withequipment costing millions of dollars. Nevertheless, there are somecomponents of the equipment that require frequent replacement during thepolishing operation that contribute significantly to the high costs ofCMP. One of these components is the retaining ring, which serves tocontain and position the wafer as it is being planarized. As such, it isimportant to minimize the cost and time to manufacture retaining rings,and to maximize the durability of such rings as well as the ease withwhich they can be replaced.

SUMMARY OF THE INVENTION

One embodiment of the invention is a chemical mechanical polishingretaining ring. The retaining ring can be comprised of a base portionmade from a wear-resistant plastic material, such aspolyetheretherketone (PEEK), and an upper portion, or backbone portion,made from a stiffer and more wear resistant material, such as a ceramicor a ceramic filled polymer. One of the base portion or backbone ispreferably overmolded onto the other. The base portion can be generallydefined by a flat pad-contacting surface, an outer surface, an innersurface, an upper rim, and a recessed portion. The base portion canadditionally include channels extending from the outer surface to theinner surface to facilitate transfer of slurry to and from the substrateto be polished during the process. Recessed portion further includes aplurality of circular ribs that serve to create a bond with theovermolded material. The recessed portion may additionally includes aplurality of bosses with threaded insert holes by which the retainingring is attached to a CMP system. The ring shaped backbone portion maycomprise one or more mounting fixtures, an inner edge, an outer edge,and a bonding surface that may include one or more ribs, channels, or acombination of these.

In some embodiments the stiffer polymer material for the backboneportion or upper portion, for example a ceramic filled polymer material,can be over-molded onto an unfilled polymer material for the base orlower portion. In other embodiments the unfilled polymer material forthe base portion or lower portion can be overmolded onto the stifferfilled polymer material for the backbone portion or upper portion.

In a further embodiment of the CMP retaining ring, the base portionfully surrounds the backbone portion, such that the backbone portion isfully encapsulated within the base portion. The base portion can begenerally defined by a flat pad-contacting surface, an outer surface, aninner surface, and an upper rim. The base portion can additionallyinclude channels extending from the outer surface to the inner surfaceto facilitate transfer of slurry to and from the substrate to bepolished during the process. The base portion further includes aplurality of circular ribs that serve to create a bond with theovermolded material. The retaining ring may additionally include aplurality of bosses with threaded insert holes by which the retainingring is attached to a CMP system. The ring shaped backbone portion maycomprise one or more mounting fixtures, an inner edge, an outer edge,and a bonding surface that may include one or more ribs, channels, or acombination of these, that serve to create a bond with the overmoldedbase portion material. In such an embodiment, the base portion isovermolded around the backbone portion such that the backbone portion isfully encapsulated within the base portion.

An advantage of an embodiment of the invention is flexural rigidityprovided by the ceramic or ceramic-filled polymeric material thatcomprises the backbone portion of the retaining ring. This rigidityreduces or eliminates deformation caused by the attachment of theretaining ring and reduces the compressibility of the retaining ring.Deformation and compressibility of the ring can lead to an unevendistribution of force across the ring, which causes undesired changes indimensions.

Another advantage of an embodiment of the present invention is the wearresistance and elasticity of the base portion of the retaining ring.Embodiments of the present invention provide a durable yet flexiblematerial that prevents chipping or cracking of the substrate edge whereit is supported by the ring while reducing wear on the ring where itcontacts the polishing pad.

Another advantage of an embodiment of the present invention is increasedbond strength between the overmolded base portion and backbone portions.The circular ribs created in the bonding portion of the base portion orbackbone portion of the retaining ring allow for a solid bond to becreated when the other portion is overmolded onto it. In embodimentsutilizing injection molding, thinner ribs and walls can be created whichprovide increased bonding and strength.

Another advantage of an embodiment of the present invention is ease ofapplication of the polishing slurry during the polishing process. Thechannels dispersed around the outside of the retaining ring base portionfacilitate the transport of slurry to and from the substrate. Thedivergent openings to the channels on the inside and outside of the ringand between adjacent pads or foil shaped pads facilitates the transportof slurry to and from the substrate.

Another advantage of an embodiment of the present invention is decreasedcost and maintenance. The retaining ring is durable and has to bereplaced less often due to its rigid upper portion and wear resistantlower portion. The injection molding and overmolding processes used tocreate the retaining ring are also simple and inexpensive processes. Inaddition, by eliminating metal from all or a part of the retaining ringin embodiments of the invention, corrosion and metal particlecontamination from abraded particles can be significantly reduced oreliminated when the retaining ring is exposed to acidic or othercorrosive polishing chemistries.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a perspective view of a CMP retaining ring according to anembodiment of the present invention.

FIG. 2 is a view of the base portion of a CMP retaining ring accordingto an embodiment of the present invention.

FIG. 3 is a diagram of a CMP system employing a CMP retaining ringaccording to an embodiment of the present invention.

FIG. 4 is a view of the base portion of a CMP retaining ring accordingto an embodiment of the present invention.

FIG. 5 is a view of the backbone portion of a CMP retaining ringaccording to an embodiment of the present invention.

FIG. 6 is an exploded view of a CMP retaining ring according to anembodiment of the present invention.

FIG. 7A is a cross sectional view of a CMP retaining ring taken alongthe line 7A-7A in FIG. 1.

FIG. 7B is a cross sectional view of a CMP retaining ring taken alongthe line 7B-7B in FIG. 1.

FIG. 8A is a perspective view of a CMP retaining ring according to anembodiment of the present invention

FIG. 8B is a perspective view of a base portion of a CMP retaining ringaccording to an embodiment of the present invention.

FIG. 8C is a perspective view of a backbone portion of a CMP retainingring according to an embodiment of the present invention.

FIG. 9A is a perspective view of a backbone portion of a CMP retainingring according to an embodiment of the present invention.

FIG. 9B is a cross sectional view taken along the line 9B-9B in FIG. 9A.

FIGS. 10A and 10B are cross sectional views taken along the line 10-10in FIG. 8A.

FIG. 11 is a perspective view of the bottom side of a CMP retaining ringaccording to an embodiment of the present invention.

FIG. 12 is a perspective view of a CMP retaining ring according to anembodiment of the present invention.

FIG. 13 is a perspective view of a portion of the bottom of a CMPretaining ring according to an embodiment of the present invention.

FIG. 14 is a close-up view of a pad contacting area of a CMP retainingring according to an embodiment of the present invention.

FIG. 15 is a cross sectional view taken along the line 15-15 in FIG. 13.

FIG. 16 is a perspective view of a portion of the bottom of a CMPretaining ring according to an embodiment of the present invention.

FIG. 17 is a perspective view of a portion of the bottom of a CMPretaining ring according to an embodiment of the present invention.

FIG. 18 is a cross sectional view of a CMP retaining ring according toan embodiment of the present invention.

FIG. 19 is a perspective view of a CMP retaining ring according to anembodiment of the present invention in a flexure testing apparatus.

FIG. 20 is a graph displaying flexure testing results of a CMP retainingring according to an embodiment of the present invention.

FIG. 21 is a perspective view of a portion of a fractured CMP retainingring according to an embodiment of the present invention.

FIG. 22 is a table displaying pull-out testing results of a CMPretaining ring according to an embodiment of the present invention.

FIG. 23 is a cross sectional view of a CMP retaining ring according toan embodiment of the present invention.

FIG. 24 is a cross sectional view of a CMP retaining ring according toan embodiment of the present invention.

FIG. 25 is a perspective view of a portion of the bottom of a CMPretaining ring according to an embodiment of the present invention.

FIG. 26 is a perspective view of a portion of the bottom of a CMPretaining ring according to an embodiment of the present invention.

FIG. 27 is a perspective view of a portion of the bottom of a CMPretaining ring according to an embodiment of the present invention.

FIG. 28 is a cross sectional view of a CMP retaining ring according toan embodiment of the present invention.

FIG. 29 is a cross sectional view of a CMP retaining ring according toan embodiment of the present invention.

FIG. 30A is an overhead view of one embodiment of the base portion of aCMP retaining ring according to an embodiment of the present invention.

FIG. 30B is a cross section view of the base portion of a CMP retainingring taken along line 30B-30B in FIG. 30A.

FIG. 31 is an overhead view of one embodiment of the base portion of aCMP retaining ring according to an embodiment of the present invention.

FIG. 32 is a perspective view of the embodiment depicted in FIG. 31.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIG. 1, there can be seen a CMP retaining ring 100according to an embodiment of the present invention. Retaining ring 100comprises a lower or base portion 102 and an upper or backbone portion122.

Referring now to FIG. 2 and FIG. 4, a separated view of lower baseportion 102 according to an embodiment of the present invention can beseen. Base portion 102 is generally defined by a flat bottom surface104, an outer surface 106, an inner surface 108, an upper rim 114, and arecessed portion 120. Recessed portion 120 further includes a pluralityof circular ribs 110 and bosses 112 with threaded insert holes 118. Ribs110 serve to create a solid bond when upper backbone portion isovermolded onto base portion and provide strength to the retaining ringby preventing twisting or bending of the ring 100. Base portion 102additionally includes channels or grooves 116 extending from outersurface 106 to inner surface 108. Ribs 110 are axial with respect toretaining ring 100, such that the ribs are substantially verticallyoriented when retaining ring 100 is in use. The use of overmolding, tocreate a thermo-physical bond between multiple pieces, is disclosed inU.S. Pat. No. 6,428,729, the disclosure of which is hereby incorporatedby reference.

Referring now to FIG. 3, there can be seen a chemical mechanicalpolishing system 200 utilizing a CMP retaining ring 100 according to anembodiment of the present invention. In practice, embodiments of the CMPretaining ring of the present invention, for example retaining ring 100,can be affixed by mounting fixtures on the ring to carrier head assembly202 of a CMP system 200, with top surface 124 of retaining ring 100flush with carrier head assembly 202. In some embodiments the retainingring 100 can be fastened by inserting fastener inserts through threadedinsert holes 118 and into corresponding holes on carrier head assembly202. Fastener inserts can be inserted into retaining ring 100 during theinjection molding process, they can be ultrasonically welded subsequentto the molding process, or they can be inserted manually. Fastenerinserts can be comprised of any suitable material, including PEEK andstainless steel. A substrate 204 is supported within retaining ring 100and is brought into contact with a polishing pad 206. Bottom surface 104of retaining ring 104 contacts polishing pad 206. The polishing pad 206operates to polish the substrates 204 due to opposing rotational forcesimparted by axles 208 a and 208 b. Typically, a slurry, a chemicallyreactive liquid, or combination of these is applied to the pad 206 andused to enhance the rate at which material is removed from the substrate204. Channels 116, with optionally divergent channel openings on theinner 108 and outer 106 surfaces in base portion 102 of retaining ring100, facilitate the transport of the slurry or chemically reactiveliquid to and from the outside of the retaining ring 100 to thesubstrate 204. Channels or grooves 116 may be created during the moldingprocess, or machined into bottom surface 104 after the molding process.

Base portion 102 can be injection molded from a plastic, preferablypolyetheretherketone (PEEK) or blends with other polymers that includePEEK or that may include other wear resistant plastic materials andblends. PEEK is advantageous in that it can support the wafer withlittle risk of chipping or cracking the substrate edge, while stillproviding high wear and abrasion resistance. Base portion 102 can alsobe comprised of PEEK that is extruded or compression molded and thenmachined. One of skill in the art will recognize that different polymerscan be used to increase or decrease the wear resistance of base portion102.

In some embodiments, after base portion 102 is molded, backbone portion122 can be overmolded thereon. In other embodiments, the backboneportion 122 can be molded first and the base portion 102 is thenovermolded onto the backbone portion 122. In other embodiments, thebackbone portion 122 or the base 102 can be machined and thecomplementary base or backbone portion overmolded onto the machinedpiece respectively.

FIG. 5 shows a view of what an overmolded upper portion or backboneportion 122 would look like as a separate piece according to anembodiment of the present invention. The circular ribbing 110 in baseportion 102 helps create a solid bonding surface with increased contactarea between backbone portion 122 and base 102. Backbone portion 122 canbe comprised of a ceramic material or other filler/additive. Forexample, the ceramic material may be dispersed in a polymer like PEEK(an example of this is STAT-PRO®, a conductive ceramic PEEK fromEntegris Inc.). The ceramic material can then be used to tailor thestructural rigidity, shear resistance, thermal conductance, or otherproperty of the backbone portion 122. The backbone portion 122structurally enhances the ring's stiffness based on its modulus. Thebackbone portion may have a flexural modular range that includes, but isnot limited to, 600,000 to 1,400,000 psi. The backbone portion 122material can be filled into the recessed portions 120 of lower baseportion 102, so that it is coplanar with upper rim 114 and bosses 112.The rigidity that a ceramic material provides will help provide solidequipment attachment and will reduce damage to the ring from theshearing, rotational, and other forces imparted by the carrier head tothe ring 100.

FIG. 6 illustrates an exploded view of an embodiment of the retainingring 100 of the present invention. A ring base portion 102 is shownhaving one or more ribs 110 on a non-fluid contacting side and optionalholes 118 for inserts. Retaining ring 100 also includes a backboneportion 122 that has mounting fixtures 126. The mounting fixture 126 mayfor example include holes for inserts 128 which can be threaded orinclude mounting protuberances (not shown) which can also be threadedfor mounting the assembled device to a tool. The holes 118, 126 forinserts 128 can optionally be molded to include threads or otherfasteners. In some embodiments, an insert such as Heli-Coil® Standardand Screw-Lock Inserts or other threaded or fastener insert may be used.The backbone portion 122 can have ribs 130 that mate with the ribs 110on the base portion 102. Alternatively, the backbone portion 122 can bemolded with ribs 130, and the ring base portion 102 overmolded onto thebackbone portion 122 to fill in the backbone portion rib channels 136.The base portion surface 104 that contacts a polishing pad can includeraised or recessed pad contacting structures termed pads or foil shapedpads, described more fully below.

The retaining ring may use or comprise threaded inserts 128. In otherembodiments the retaining ring can comprise one or more tapped threadsformed directly into the ring without the use of inserts. An over-moldedretaining ring with two materials, for example the backbone portionbeing the stiffer of the two, can provide greater pull-out andtorque-out strength than with just the base portion material alone.

FIGS. 7A and 7B illustrate cross sections of an embodiment of theinvention. FIG. 7A shows a cross section taken at an insert hole 126while FIG. 7B shows a cross section between insert holes. The backboneportion ribs 130 are shown interlocking or engaging the ribs 110 of thebase 102. In various embodiments the ribs 130 of the backbone portion122 can be formed by molding, machining, any combination of these, orother suitable process to make the ribs. The base portion ribs 110,outer wall 106, and bottom pad contacting surface 104 may be formed bymolding or machining or any combination of these. The base portion 102can have a beveled edge, for example a beveled outside edge 105 whichcan form part of the base portion pad structures. An insert 128, whichcan be threaded, is shown through a hole 126, cavity or recessed portionof the backbone portion 122 and penetrating into a portion 118 of thebase portion 102. The base portion 102 and backbone portion 122 may beheld together by bonding of the base portion and backbone portionmaterials during molding or by use of an adhesive, by the action of athreaded bolt or screw in the inserts, or any combination of these orother fixture mechanisms. As depicted in FIGS. 7A and 7B, base 102 andbackbone 122 are meshed, or interlaced, with one another following theovermolding process.

FIGS. 8A-8C illustrate ribs 110, 130 which may be present in variousembodiments of the invention. The backbone portion 122 and base portionring 102 can have ribs that can mate and be bonded together using anover-molding process. The 1^(st) shot may be coated or primed toincrease the bond to the 2^(nd) shot of material.

FIGS. 9A and 9B illustrate a backbone portion 322 of a retaining ringaccording to an embodiment of the present invention. Backbone portion322 may include ribs 330-333 of varying size and shape. The ribs 330-333of the backbone portion 322 can mate with corresponding ribs on the baseportion where machined base portion and backbone portion rings arejoined. The backbone portion ribs can include rib channels 336, 337.Ribs may include one or more voids 338 of varying size and shape along agiven rib. There can be one or more rows of ribs 330-333 or one or morerows of channels 336, 337 from the inner to the outer surface of thebackbone portion 322. The rib channels 336, 337 and rib voids 338 may befilled with overmolded base portion material or mated with acorresponding machined part and fastened together. The rib channel andrib void size can be chosen depending upon the strength, structuralrigidity, and base portion bonding requirements for the retaining ring.The high surface area of the ribs, rib channels, and optional rib voidsincrease the bonding area with the base. The ribs, channels, and ribvoids promote stiffness in the retaining ring. The top backbone portionsurface 324 contacts the machine tool carrier head assembly. Thebackbone portion stop 334 provides a bonding surface for a portion ofthe base portion along the outer diameter of the retaining ring.

The ribbed structure of the backbone portion adds structural rigidity tothe backbone portion in the completed retaining ring. The ribs alsoprovide for increased surface area for bonding the base portion layer tothe backbone portion. The ribs create proper wall sections for injectionmolding that allow for a first shot of material and an over-moldedsecond shot of material. The size of the ribs and troughs can be chosento allow for the injection molding. In some embodiments the ribs canhave a height of about 2.5 cm or less from trough to top, preferablyless than about 1 to about 1.5 cm. In preferred embodiments there are atleast two ribs and preferably three ribs extending from each respectiveportion in opposite axial directions, the respective ribs being ininterlacing engagement with sidewalls of the ribs preferably havingparallel faces. The interlacing portions of the ribs preferably extendat least 25 percent of the axial thickness of the rib.

The backbone portion can comprise a moldable composite thermoplasticmaterial. One example of a useful material for the backbone portionincludes processable rigid rod polymers based on a string of substitutedand unsubstituted phenylene rings that produce a highly rigid structure.Small amounts of these kinds of resin can be used to reinforce otherpolymers used for the backbone portion such as PEEK. Examples of rigidrod polymers that may be used include but are not limited to Parmax SRP(from Mississippi Polymer Technologies), Celazole® PBI(polybenzamidazole) (CELAZOLE is a registered trademark of CelaneseAdvanced Materials, Inc.), PEEK w/PBI fiber and PBO (polyphenylenebenzobisoxazole). The moldable composite may be a thermoplastic materialthat contains a ceramic filler that provides structural rigidity to theretaining ring which has one or more channels with divergent inlets andoutlets. The composite thermoplastic can optionally have good thermalconductivity. Examples of such composite materials may include thosedisclosed in U.S. Pat. No. 5,024,978 the contents of which areincorporated herein by reference in their entirety into the presentdisclosure. The composite thermoplastics can include fiber-reinforcedceramic matrix composites. The inorganic or ceramic reinforcing fiberscan be dispersed with thermoplastic solids that have been melted. Theseheated liquid dispersions can be used in subsequent molding operationsto form the backbone portion ring. Inorganic or ceramic materials mayinclude powdered glasses, such as powdered aluminosilicate glasses orpowdered borosilicate glasses, powdered aluminosilicate glasses whichare thermally crystallizable to yield refractory glass-ceramic matricessuch as matrices comprising .beta.-spodumene, anorthite, cordierite, orother phases, and crystalline materials useful for composite manufacturesuch as but not limited to for example, alumina, zirconia, siliconcarbide, silicon nitride, combinations of these and other materials. Avariety of reinforcing particles and or fibers including those selectedfrom the group comprising fibers of carbon, silicon carbide, glass,silicon nitride, alumina, mullite or similar materials may also be used.In selecting particles and or fibers for the filler, the physical formin which the particle and or fibers may be chosen according to therequirements of subsequent processing or the configuration or propertiesdesired in the composite preform or end product. Thus, for example, thefibers may be provided in the form of a woven or non-woven fiber fabric,fiber tows, i.e., fiber bundles or other groups of fibers formingmulti-fiber yarns, cords or twine can be selected. Particle shapes mayinclude but are not limited to plate-like, spherical, oblong,irregularly shaped, or any combination of these.

The backbone portion of the retaining ring is a material that ismechanically stiffer than the wear resistant base portion material. Someembodiments of the retaining ring may comprise a metal containingbackbone portion which can include a machined metal backbone portionwith ribs, a backbone portion made from sintered powdered metal formedin the shape of a backbone portion with or without ribs, a backboneportion made from an injection molded metal. The geometry of a metalbackbone portion can be similar to plastic backbone portion. It caninclude ribs for structure and to allow for even wall sections for theover-molding of a second shot of polymer to form the base. The metalbackbone portion may also incorporate undercuts with respect to thesecond shot for mechanical bonding.

One advantage of the all polymer retaining ring in embodiments of theinvention is that the polymers can be formulated or treated so they havereduced amounts or are free of ionic impurities for microelectronicmanufacturing applications and can be chosen and outgas very little,thwarting the trace contamination from sodium, aluminum, iron, copper,lithium, and other inorganic elements that commonly leach out ofconventional ceramic retaining rings. Polymers can also allow one singleCMP ring material set for the entire range of CMP processes (i.e. Oxide,Tungsten, Copper). A single ring per wafer lowers overall consumablescosts as one material set can handle rings for an entire fab line. Thepolymer material set can be chosen to be chemically compatible andhandle a wide array of chemistries including a broad pH rangeencountered in CMP processing. The polymers can be chosen for theirhydrolytic and dimensional stability in liquid or aqueous slurryenvironments such that substrate polishing rates and or polishinguniformity across the substrate are maintained with in processtolerances.

FIGS. 10A and 10B detail an inverted cross section of a molded retainingring 300 according to an embodiment of the present invention. FIG. 10Aillustrates molded base portion flashing 340 on the inside and outsidediameters of the backbone portion 322 that can be formed in a moldingoperation. The flashing thickness can be adjusted. One or more surfacesof the ring may be finished by a post molding machining operation toremove all or a portion of the flashing, as shown in FIG. 10B. Postmachining can remove the flashing to a final surface and finishillustrated by the solid line 342 in FIG. 10A. As illustrated by thetongue and groove structure of the base portion and backbone portion inFIGS. 10A and 10B, a cross section of a retaining ring could becharacterized by one or more overlapping regions of base portion andbackbone portion material.

FIG. 10B details a cross section of the retaining device 300 thatillustrates an embodiment with base portion flash removed from thearticle in an optional post bonding or post molding process. Followingmachining, surfaces that do not contact the pad can be furtheroptionally finished with about 600 grit or finer polishing paper. Forsurfaces that contact the pad or substrate, polishing paper of about1500 grit or finer can be used. For less critical substrates or pads,lower grit polishing or as machined surfaces can be used.

FIG. 11 illustrates a perspective view of a retaining ring 300 having apad contacting surface 304 of the ring base portion 302 with one or moreraised pad contacting areas 315 with recessed channels or grooves 316between them. The grooves or channels 316 can have divergent inlet,divergent outlets, or any combination of these. The channels 316 andraised pads 315 can be positioned or formed circumferentially about thering and permit fluid flow, for example a polishing fluid or slurry,between the inner and outer diameters of the ring when it contacts apolishing pad and is rotated during use. While the description of theretaining ring, base, and backbone portion have been described andillustrated with ring shapes, other shapes may be possible provided thatthe more generally retaining base portion can be mounted to a movingcarrier and has an inner surface perimeter that holds the substrate andpreferably corresponds to about the perimeter of the substrate. The pads315 with fluid channels 316 between them can have an outer edge thatessentially parallels the outer edge or circumference of the ring 300and the pads 315 can have an inner edge with one or more surfaces thatessentially parallel the inner edge of the ring 300. The pads 315 can bespaced apart from each other and form variously shaped channels 316 asillustrated in FIG. 13, FIG. 14, FIG. 16, FIG. 17, FIG. 25, FIG. 26, andFIG. 27. In some cases the slurry grooves or channels may be curved orparallel between two adjacent pads. In some embodiments, as shown inFIG. 17, the channel or slurry groove may be tapered. The channels orslurry grooves can have a divergent, widened, or funnel shaped channelon the inner side, outer surface, or any combination of these. Thedivergent channel surfaces improve the transfer of fluid between theinner and outer ring surfaces and the retained substrate. Edges of thepad structure can be beveled to reduce wear on the polishing pad andretaining ring. The depth of the channels can be modified (made deeperor more shallow) to accommodate or modify the flow of fluid (polishingslurry or other liquid) into and out of the inner ring area (wheresubstrate is located). The channels can have one or more divergent endson the inner ring diameter surface, outer ring diameter surface or both.The shape of the divergent channels or grooves on the inner and outersides of the ring can be asymmetric in volume to modify fluid velocityin the region of the ring and facilitate movement of fluid into or awayfrom the substrate. The shape of the divergent channels may be modifiedfor particular slurry composition, viscosity, particle size, androtation rate of the retaining ring to achieve a desired polishing ormaterial removal rate and or uniformity.

The ring shaped structure 300 or carrier assembly illustrated in FIGS.11 and 12 can be used to retain a substrate for polishing or othersurface treatment. In some embodiments, the retaining ring 300 has ashape that permits mounting to a rotating plate and retention ofcircularly shaped substrates. The retaining ring has an inner surface308 or diameter exposed to contact a peripheral edge of a substrate tobe polished; the substrate is held against a polishing surface or pad.The retaining ring 300 can comprise a ring shaped base portion 302 thatcontacts a polishing pad. The ring shaped base portion 302 can be madeof a material that comprises a wear resistant material and that retainsits shape under the load of the tool. The ring shaped base portion 302can include a pad contacting surface side 304, an inner edge or surface308, an outer edge or surface 306, and one or more ribs and/or ribchannels (shown in FIGS. 10A and 10B). The pad contacting surface 304 ofthe ring shaped base portion 302 can comprise one or more channels orgrooves 316 and one or more pads 315 between the inner edge surface 308and an outer edge surface 306 of the ring shaped base portion 302.

The retaining ring 300 can further comprise a ring shaped backboneportion 322. The ring shaped backbone portion 322 can be made of amaterial that is different from the ring shaped base portion 302. Insome embodiments, the ring shaped backbone portion 322 comprises astiffer and more wear resistant material than the base, for example aceramic thermoplastic composite. The ring shaped backbone portion 322can include one or more mounting fixtures 326, an inner edge surface323, an outer edge surface 325, and one or more ribs and/or rib channels(shown in FIGS. 10A and 10B). The ring shaped base portion 302 and ringshaped backbone portion 322 are joined along an interface that comprisesbonding surfaces between their corresponding ribs and channels as shownin FIGS. 10A and 10B. These bonding surfaces can be joined by chemicalbonding, welding or fusion bonding, mechanical bonding, overmolding onematerial onto the other, or any combination of these. The base portionmaterial and the backbone portion material can form cohesive bonds alongthe surfaces of the ribs and rib channels where they contact. Themounting fixtures can comprise structures that couple the ring shapedbackbone portion to a tool or rotating platen.

The channels or grooves in the surface of the base portion of theretaining ring can further include one or more divergent openings whichmay be inlets, outlets or combination of these between the inner andouter surfaces of the retaining ring. The channel cross section can havea rectangular shape, a radius shape, or other shapes. The shape of thecross section of the channel can be chosen to reduce or eliminate lowflow areas or dead volumes in the channels, channels with a radius shapecan provide a more uniform slurry of liquid flow velocity along thechannel or groove surface. In some embodiments, the void volume of thedivergent openings in the base, for example where channel walls are notparallel, can be greater than the channel void volume (where channelwalls are parallel). In some embodiments the base portion material hashigher wear resistance than the backbone portion. The ring shaped baseportion of the retaining ring can comprise a wear resistantthermoplastic like PEEK or a co-polymer of PEEK. The ring shapedbackbone portion of the retaining ring can comprise a ceramic filledthermoplastic material that is stiffer than the base portion of theretaining ring. The ceramic material that may be used as a backboneportion can have a higher density than the material used for the base.

An embodiment of the structure of the retaining ring pads 315 or foilsis illustrated in FIG. 14. The shape of the channels 316 formed betweenpads 315 is illustrated in FIG. 13. One advantage of the presentinvention is that the channels 316 improve the utilization of polishingslurry and reduce costs of polishing. The channels 316 or groovesbetween the retaining ring pads 315 provide for fluid, liquid, or slurryflow which can be along a groove formed by a leading edge of one padstructure and the bottom inner edge of an adjacent pad structure. Thedivergent inlet on the inner diameter of the ring of these channels canbe shaped by the bottom inner edge of one pad and the leading edge andleading surface of the adjacent pad or foil. The divergent outlet on theouter diameter of the ring can be formed by the bottom inner pad edgeand trailing edge of one pad with the leading edge and outer edge of anadjacent pad. The channel shape promotes transfer of fluid and slurrybetween the inner diameter of the ring (where the substrate is held) andthe outer diameter of the ring.

In FIG. 13, the shaped channel inlet 319 (opens to the inner ringsurface or edge) and shaped channel outlet 317 (opens to the outer ringsurface or edge) can be varied and, for example, the void volume of theinlet 319 can be made large than the void volume of the outlet 317. FIG.15 shows a cross section along that illustrates an optional bevel 305 onthe outer pad surface. The adjacent pads can be positioned relative toone another to form a channel or groove. The channel walls may beparallel or non-parallel. Inlet 319 and outlet 317 may be created duringthe molding process, or machined into retaining ring 300 after themolding process.

Referring now to FIG. 14, the one or more pads 315 or foils that formchannels along the ring can have an inner pad surface 344 that can havean edge or portion of its perimeter that is tangent, parallel, orcurvilinear with a portion of the inner ring surface. A portion of thepad 315 can be offset from the inner ring surface. The trailing 346 andleading 348 edges can optionally be rounded, beveled, or otherwiseformed with a radius. A rounded shape is advantageous for fluid flow andreduces particle generation during handling because it can prevent snagswith gloves or polishing pad irregularities. The leading surface 350 ofthe pad can form a channel or groove with the inner pad surface of anadjacent pad. A portion of the outer pad surface 352 and beveledtrailing surface 354 can be tangent, parallel, or curvilinear with aportion of the outer ring surface. The shape of the pad from the leadingedge 348 to the outer pad surface 352 and trailing edge 346 can bechosen to have a length that is greater than the length from the leadingedge 348 to the trailing edge 346 along the inner pad surface 344.

FIG. 15 shows the beveled edge 305 of a pad structure 315 along theouter edge 306 of the ring along the base. A hole 318, 326, recess, orcavity which can be threaded or used for a mounting insert or mountingprotuberance is shown traversing the backbone portion 322 and baseportion 302. In some embodiments (not shown) the hole may only traversethe base portion 302. FIG. 15 also illustrates a step 307 formed betweenthe divergent inlet recessed into the base portion surface and thesurface of the base portion that contacts the pad 304. The size of thisstep can vary along the pad structure or pad.

The depth of the channel or groove of the pad can be made to handle theslurry flow requirements between the inside and outside of the retainingring during a polishing process. As shown in FIG. 18, the cross sectionof a slurry groove 316 in base portion 302 can include a smooth radiuswithin the groove. In some embodiments the groove has a rectangularcross section. In various embodiments of the grooves, the deepestportion of the groove can be about 0.5 cm or less. In some embodimentsthe deepest portion of the channel can be about 0.25 cm or less.

Testing has proven that the above embodiments provide a rigid structure.As shown in FIGS. 19-21, a retaining ring 400 according to an embodimentof the present invention was flexure tested with a flexure testingapparatus 460. Retaining ring 400 was made from a molded Parmax(Mississippi Polymer Technology) backbone portion 422 and overmoldedwith 450 g of PEEK base portion 402. Flexure testing continued until thering 400 fractured. Testing results 462 are shown in FIG. 20. Theresults illustrate that a lightweight retaining ring 400 with ribs andchannels that are overmolded provides a rigid structure. Even whenfractured, as shown in FIG. 21, the base portion 402 and backboneportion 422 remain cohesive along their bonding surfaces.

Further testing has demonstrated the substantial pull-out strength ofthe backbone portion of embodiments of the present invention. Mountingof the retaining ring to the CMP platen rotating head was facilitated bymultiple threaded bolts. The ceramic filled PEEK allows multiple tappedthreaded holes to be produced around the perimeter to secure theretaining ring to the head. Test samples used stainless steel sockethead cap screw—#8-32 that were threaded in 3 full turns into tapped#8-32 threads. The retaining ring backbone portion used a ceramic filledPEEK. The results 500 from the test are shown in the Table in FIG. 22.

Referring now to FIGS. 23 and 24, a cross-section of a furtherembodiment of the present invention is depicted. CMP retaining ring 400comprises a base portion 402 and a backbone portion 422. Base portion402 is generally defined by a flat bottom surface 404, an outer surface406, an inner surface 408, and an upper surface 410. Base portion 402can include a beveled edge, for example beveled outside edge 405. Baseportion may also include one or more annular ribs 412. Backbone portion422 may include one or more annular ribs 430 adapted to mate with ribs412 on base portion 402. In the present embodiment, backbone portion 422is molded first, and base portion 402 is overmolded onto backboneportion 422, such that backbone portion 422 is fully encapsulated withinbase portion 402. Ribs 412 and ribs 430 provide additional bondingsurfaces for base portion 402 and backbone portion 422, increasing thebond strength between base portion 402 and backbone portion 422.

Base portion 402 can be injection molded from a plastic, preferablypolyetheretherketone (PEEK) or blends with other polymers that includePEEK or that may include other wear resistant plastic materials andblends. PEEK is advantageous in that it can support the wafer withlittle risk of chipping or cracking the substrate edge, while stillproviding high wear and abrasion resistance. Base portion 402 can alsobe comprised of PEEK that is extruded or compression molded and thenmachined. One of skill in the art will recognize that different polymerscan be used to increase or decrease the wear resistance of base portion402.

Backbone portion 422 can be comprised of a ceramic material or otherfiller/additive. For example, the ceramic material may be dispersed in apolymer like PEEK (an example of this is STAT-PRO®, a conductive ceramicPEEK from Entegris Inc.). The ceramic material can then be used totailor the structural rigidity, shear resistance, thermal conductance,or other property of backbone portion 422. Backbone portion 122structurally enhances the stiffness of CMP ring 400 based on itsmodulus, wherein backbone portion 422 may have a flexural modular rangethat includes, but is not limited to, 600,000 to 1,400,000 psi. Therigidity that a ceramic material provides will help provide solidequipment attachment and will reduce damage to the ring from theshearing, rotational, and other forces imparted by a carrier head to CMPring 400.

FIG. 24 depicts molded base portion flashing 440 on CMP ring 400. Baseportion flashing 440 may be present on base portion 402 after themolding operation. One or more surfaces of ring 400 may be finished by apost-molding machining process to remove all or a portion of theflashing. Post-molding machining can remove the flashing to a finalsurface and finish illustrated by the solid line 442. Followingmachining, surfaces that do not contact the polishing pad can be furtheroptionally finished with about 600 grit or finer polishing paper. Forsurfaces that contact the pad or substrate, polishing paper of about1500 grit or finer can be used. For less critical substrates or pads,lower grit polishing or as machined surfaces can be used.

FIGS. 25-27 depict further embodiments of the structure of retainingring pads or foils 315 and channels or grooves 316. Channels 316 may bestraight, curved, or arcuate. CMP ring 300 includes a pad contactingsurface 304, made up of a plurality of foils 315. In a preferredembodiment, the pad contacting surface 304 is between 75% and 95% of thetotal area of ring 300. In a further embodiment, the pad contactingsurface 304 is less than 92% of the total area of ring 300. In analternate embodiment, the pad contacting surface 304 is less than 90% ofthe total area of ring 300. In a further alternate embodiment, the padcontacting surface 304 is less than 88% of the total area of ring 300.

Channels 316 provide for slurry flow, and each channel 316 includes aninlet portion 319, an outlet portion 317, and a neck portion 311. Byvarying the shape of foils 315, the shape of channels 316, the shape ofinlet 319 and outlet 317, or any combination thereof, the slurrytransfer characteristics can be adjusted, thereby adjusting thepolishing process. Numerous parameters of channel 316 can be modified,such as the angle α, the width, the depth, the radii where channel 316meets outer surface 306 and inner surface 308, as well as the overallnumber of channels 316 on ring 300. FIG. 26 depicts a CMP ring 300having a channel 316 with larger radii in the area where channel 316meets outer surface 306 and inner surface 308, as compared to the radiiof channel 316 depicted in FIG. 25. Angle α of channel 316 in FIGS. 25and 26 is 150 degrees.

FIG. 27 depicts a CMP ring 300 having a greater contact surface 304 ascompared to CMP ring 300 in FIGS. 25 and 26, while maintaining the samering dimensions. The radii where channel 316 meets outer surface 306 andinner surface 308 have been decreased as compared to FIG. 25 to increasethe area of contact surface 304. The angle α of channel 316 is 144degrees, however, the numerical values of angle α presented herein arefor illustrative purposes only and should not be considered limiting.

Angle α is measured relative to a line drawn tangent across outersurface 306 at the point where channel 316 would intersect with outersurface 306 if channel 316 did not include outlet portion 317, asillustrated in FIGS. 25-27. The angle of the channel can be taken withrespect to a first reference at a side wall of the channel where theside walls are parallel in the central portion of the ring or saidreference can be at the mid line of the channel in the central portionof the ring (intermediate the outer periphery and the inner periphery)where the sidewalls of the channel are not parallel. For reference,angle α is for counterclockwise rotation of ring 300 when pad surface304 is facing downward into a polishing pad. In a preferred embodiment,angle α is at least 130 degrees.

The shape of the ribs and rib channels of the various embodiments of thepresent invention may be varied to modify the bonding between a base anda backbone. For example, the ribs and rib channels may be annular andconcentric with the retaining ring profile when viewed from above, asdepicted in FIGS. 2, 4-6, 8B, 8C, and 9A. The ribs and rib channels maybe continuous around the ring, or may be non-continuous, such asdepicted in FIGS. 9A, 9B, 30A, 31, and 32. The ribs and rib channels mayalso be non-concentric with the ring profile, having for example aspiral shape when viewed from overhead. Further, the ribs may benon-concentric such that they extend generally from one inner edge ofthe ring to the other, for example the ribs may be orthogonal to anedge, or meet an edge of the ring at an angle. The non-concentric ribsmay fully extend from one edge of the ring to the other, or they mayextend only partially between edges of the ring, as depicted in FIG.30B.

Additionally, the ribs may have a flared or tapered cross-section tocreate mechanical coupling between the base and the backbone, asdepicted in FIGS. 28 and 29. For example, if a backbone is first moldedhaving one or more ribs with a flared cross-sectional profile, when abase portion is overmolded onto the backbone, the base will beinterlocked with the backbone after the molding process. Similarly, abase portion can be first molded having one or more ribs with a flaredcross-sectional profile, such that when a backbone is overmolded ontothe base portion, the backbone and the base are interlocked.

Further, ribs may be provided with transverse passageways to createmechanical interlocking between the base and the backbone, as depictedin FIG. 32. For example, if a base portion 102 is first molded havingone or more ribs 110 including one or more transverse passageways 127,when a backbone is overmolded onto base 102, the material flows intopassageways 127, creating a mechanical bond between the backbone andbase 102. Similarly, a backbone can be first molded having one or moreribs including one or more transverse passageways. When a base portionis overmolded onto the backbone, the material fills in the passageways,thus creating a mechanical bond between the base and backbone. In thecase of multiple ribs, the transverse passageways provide a link betweenneighboring rib channels.

The embodiments above are intended to be illustrative and not limiting.Additional embodiments are within the claims. Although the presentinvention has been described with reference to particular embodiments,workers skilled in the art will recognize that changes may be made inform and detail without departing from the spirit and scope of theinvention.

1. A retaining ring for use in a chemical mechanical polishingoperation, comprising: an annular backbone portion having one or morecircumferential and axially projecting backbone portion ribs with one ormore channels defined by the one or more ribs, the ribs having an axiallength greater than a corresponding width and the backbone portioncomprising a rigid polymer material; and a wear-resistant polymer baseportion having a flat bottom surface, one or more circumferential andaxially projecting base portion ribs with one or more channels definedby the one or more ribs, the ribs having an axial length greater than acorresponding width and a plurality of grooves in the bottom surfaceextending between an inner edge and an outer edge of the retaining ring,the grooves adapted to facilitate transfer of slurry during thepolishing operation, wherein the backbone portion and the base portionare bonded together by an overmolding process such that the backboneportion ribs mate to the base portion channels and the base portion ribsmate to the backbone portion channels such that they are directlyinterlacing and conforming with each other, and wherein the backboneportion ribs and the base portion ribs extend a portion of an axialthickness of the bonded backbone portion and base portion.
 2. Theretaining ring of claim 1, wherein the plurality of grooves each includeat least one divergent opening.
 3. The retaining ring of claim 1,wherein the base portion encapsulates the backbone portion.
 4. Theretaining ring of claim 1, wherein the base portion comprisespolyetheretherketone and the backbone portion comprisespolyetheretherketone blended with ceramic.
 5. The retaining ring ofclaim 1, further comprising mounting fixtures for securing the retainingring to a polishing unit.
 6. The retaining ring of claim 1, wherein theangle of the grooves relative to a line tangent to the outer edge is atleast 135 degrees.
 7. The retaining ring of claim 1, wherein the groovesdefine a plurality of pad contacting areas, the pad contact areascomprising less than 92% of the area of the bottom surface.
 8. Theretaining ring of claim 1, wherein the backbone portion ribs and baseportion ribs are interlaced and the interlaced portion extends at least25% of the axial thickness of the retaining ring.
 9. The retaining ringof claim 1, wherein the annular backbone portion has three axiallyprojecting backbone portion ribs.
 10. The retaining ring of claim 1,wherein the polymer base portion has three axially projecting baseportion ribs.
 11. The retaining ring of claim 9, wherein the polymerbase portion has three axially projecting base portion ribs.
 12. Theretaining ring of claim 1, wherein one of more of the base portion ribshas a flared cross-section.